![]() ![]() The temperatures during the soak stage increase slower than during the preheat stage. ![]() The oxide on the surfaces of components and PCB pads is also removed. The reflow soak stage is the step where the solder paste removes moisture, and the flux activates so it can solder. The lead-free reflow preheat stage lasts about 60 seconds to 120 seconds. Lead-free reflow preheat temperatures reach about 150☌ to 190☌, and the preheat slope rate is about 0.75℃/sec to 2℃/sec. The other reason for this is preparation for reflow to avoid thermal shock and harm to the SMD components, insufficient soldering on PCB pads, solder balls in non-soldering areas, and spattering. When the PCBAs go into the lead-free reflow oven, they are preheated slowly at a uniform rate to remove the moisture and solvent in the solder paste. In the lead-free reflow oven, the PCBAs are transferred by the conveyor belt and undergo four stages: 1. The reflow oven raises the temperatures by heating nitrogen gas. Lead-free reflow is fully automatic and happens in the lead-free reflow oven, which has ten temperature chambers (tin-lead reflow oven has eight). When the PCBAs cool down, the SMD components are soldered on the PCB pads. Lead-free reflow soldering is the process of adjusting reflow oven temperatures to melt and cure lead-free solder paste on the PCB pads during PCB assembly. Tin-Lead Reflow Part 4: Advantages of Lead-Free Reflow Soldering Part 5: Lead-Free Reflow PCB Soldering One-Stop Solution Part 1. Part 1: What is Lead-Free Reflow Part 2: Lead-Free Reflow Profile Part 3: Lead-Free Reflow vs. ![]()
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